When asked about their long-standing expectations for electronic products, people will respond without hesitation with the following keywords: smaller, lighter, faster, and more multi-functional. Advanced printed circuit board assembly technologies, such as PoP (Package on Package) technology, have been widely adopted and implemented to assist modern electronic devices in meeting those criteria.

Package on Package Introduction

In a nutshell, "package on package" refers to the practice of stacking components or ICs (Integrated Circuits) together on a motherboard. PoP is a cutting-edge packaging technique that allows the integration of multiple integrated circuits (ICs) into a single package with logic and memory devices in the top and bottom packages, increasing memory density and performance while decreasing mounting area. The regular structure and the TMV structure are the two structural types of PoP. Memory devices or stacked memories are typically placed in the top package, and logic devices are placed in the bottom package. 

The TMV (Through Mould Via) structure implements its internal connection between logic and memory devices in the bottom package via a mould. It is a revised version of a PoP standard structure. Package on package surface mount assembly relies on two critical technologies: pre-stacked PoP and on-board stacking PoP. The main difference is how frequently they reflow solder: the former does it twice, while the latter only once.

The Benefits of Package on Package 

Because of its numerous advantages, OEMs are increasingly implementing Package on Package technology:

• Flexibility - The PoP stacking structure offers OEMs a wide range of stacking options, allowing them to easily change the functions of their products. For instance, they are permitted to convert low-memory chips into high-memory chips to meet emerging demands without having to alter the motherboard's circuit board design.
• Reduction in overall size
• Lowering overall costs
• Reducing the complexity of motherboards
• Better logistics management
• Increasing the level of technology reuse

Fields of Application for Package on Package

The features of PoP work flawlessly on a wide range of portable electronic devices, including mobile phones, digital cameras, portable media players, personal digital assistants, and other gaming and music equipment.

PCBCart has previously worked successfully on surface mount assembly while serving a variety of fields. Using cutting-edge technologies, strict manufacturing standards, modern equipment, and qualified technical personnel, we are improving items up to custom-developed products.

About M-Tek Assembly Ltd 

M-Tek Assembly is a PCB manufacturer that specialises in producing low-cost, high-quality printed circuit boards and package on package assembly. We have years of industry experience, and our team of skilled engineers will guide you through the entire process. You will also be helping to save the environment by using M-Tek for printed circuit board repairs. We have achieved a net-zero carbon footprint by using electric vehicles, and for every circuit board we build, we plant a tree! Contact one of our SMT and PCB assembly experts today for assistance. Call 01189 455377 or follow us on Twitter to learn more about our services.