Changing each soldered ball on a grid array circuit is known as BGA reballing. The need to rebalance a chip can occur for a variety of reasons, which we will discuss in this article. We'll also pay close attention to what BGA reballing is and how it affects solder joints. We will also delve into the actual BGA reballing procedure and examine the four main reasons why engineers frequently use BGA chip reballing to solve multiple problems.

Reballing: What is it?

An engineer creates a ball grid array circuit to ensure a precise connection between the printed circuit board (PCB) and the chip. In some instances, an older ball joint will require the engineer to recreate the ball solder joints to get the most out of that specific BGA chip. In general, this procedure entails removing all of the old solder balls and replacing them with fresh ones. It should be noted that motherboards for gaming consoles, laptops, and PCs frequently undergo reballing, with the video graphic chip, or VGC, being the usual culprit.

It should be noted that VGCs are frequently regarded as unlucky in the industry due to their propensity for solder joint breakage and the need for repeated repairs throughout their lifespan. Even the most recent BGA circuit chips will eventually require rebalancing, either because of flakiness or a break.

How Poorly Sealed Joints Hinder Performance

On your computer system or gaming console, you might notice that the screen suddenly turns black while you are watching a video or playing a game. The "blank screen of death" is frequently the result of poor solder joints. Inadequate solder joints may also cause horizontal or vertical dots or lines to appear on the screen. So, BGA reballing might be necessary to get the system to boot as intended.

Why Reballing a BGA Chip May Be Necessary

Overuse is the first cause. That is, BGA reballing may be necessary if a graphics chip has been overused, which may include running it continuously for a long period or continuously for several days. The solder joints between the PCB and the chip will frequently deteriorate over time and become loose. As a result, the user might experience display problems that worsen over time.

BGA chips could also develop faults, in which case the user would have to buy new ones. A BGA chip upgrade may also be required on a PCB motherboard to improve performance or support the new software. Finally, rebalancing a BGA chip may be necessary due to overheating. In other words, chip overheating might cause the solder ball to get hot, which might make it loosen and move over time. In fact, in the worst case, the solder might create a solder bridge, which, if ignored, will effectively destroy your computer.

If you want to learn further about BGA reballing or need it for your next projects give our experts at M-Tek Assembly Ltd a call today at 01189 455377. By using M-Tek for your BGA reballing, you will also be helping to save the environment. We have achieved a net-zero carbon footprint through the use of electric vehicles, and we plant a tree for every circuit board we build!